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BU97941FV product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1/22 tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 datashee t multifunction lcd segment driver BU97941FV max 104 segments (seg26com4) features ? integrated ram for display data (ddram): 26 x 4 bit (max 104 segments) ? lcd drive output: 4 common output, 26 segment output ? integrated 4ch led driver circuit ? support standby mode ? integrated power-on-reset circuit (por) ? integrated oscillator circuit ? no external component ? low power consumption design ? independent power supply for lcd driving applications ? telephone ? fax ? portable equipment (pos, ecr, pda etc.) ? dsc ? dvc ? car audio ? home electrical appliance ? meter equipment etc. key specifications supply voltage range: +1.8v to +3.6v lcd drive power supply range: +2.7v to +5.5v operating temperature range: -40c to +85c max segments: 104 segments display duty: static, 1/3, 1/4 selectable bias: static, 1/3 interface: 3wire serial interface package w (typ.) x d (typ.) x h (max.) typical application circuit figure 1. typical application circuit ssop-b40 13.60mm x 7.80mm x 2.00mm signal input from controller *about resistor value determine the optimal value based on the applied curr ent with 25ma as max per 1 port 5.0v 3.3v vlcd vdd csb sd scl vss bu979 4 1fv lcd com0 to com3 seg0 to seg25 led1 vled=5.0v led2 led3 led4
2/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 block diagram / pin configuration / pin description figure 2. block diagram figure 3. pin configuration (top view) table 1 pin description pin name pin no. i/o setting when not in use function csb 26 i vdd chip select: "l" active scl 27 i vss serial data transfer clock sd 28 i vss input serial data vdd 29 - - power supply for logic vss 25 - - external clock input terminal (for display/pwm using selectable) support hi-z input mode at internal clock mode vlcd 30 - - gnd com0 to 3 31 to 34 o open power supply for lcd seg0 to 25 1 to 20 35 to 40 o open common output for lcd led1 to 4 21 to 24 o open led driver output common counter oscillator lc d bias selector common dr ive r power on reset sd scl / clkin vss vss com0??com3 seg0??seg2 5 if fi lte r seri al inter fac e ddram lcd voltage generator command regis ter data decoder vlcd csb vdd segment driver led driver led4...led1 external clock line led4 led3 led2 led1 1 20 21 40 vss csb scl sd vdd vlcd com3 com2 com1 com0 seg4 seg3 seg1 seg0 seg5 seg9 seg10 seg11 seg12 seg7 seg8 seg15 seg16 seg17 seg18 seg13 seg14 seg19 seg20 seg23 seg24 seg25 seg21 seg22 seg6 seg2
3/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings (vss=0v) item symbol ratings unit remarks power supply voltage1 vdd -0.3 to +4.5 v power supply power supply voltage2 vlcd -0.5 to +7.0 v voltage for liquid crystal drive power supply voltage2 vled -0.5 to +7.0 v voltage for led driving port terminal allowable loss pd 0.8 *1 w input voltage range vin -0.5 to vdd+0.5 v operating temperature range topr -40 to +85 storage temperature range tstg -55 to +125 output current iout1 5 ma seg output iout2 5 ma com output iout3 50 ma led output (per 1 port) *decreases 8mw per 1 when using at 1 ta=25 or higher. during rohm standard board mounting board size 74.2mm 74.2mm 1.6mm material fr4 glass-epoxy board copper foil land pattern only recommended operating ratings(ta=-40c to +85c,vss=0v) item symbol min typ max unit remarks power supply voltage1 vdd 1.8 - 3.6 v power supply power supply voltage2 vlcd 2.7 - 5.5 v voltage for liquid crystal drive output current iout1 - - 25 ma led output (per led1 port) iout2 - - 100 ma led output (led port current total sum) electrical characteristics dc characteristics (ta=-40c to +85c vdd=1.8v to 3.6v vlcd=2.7v to 5.5v vss=0v ) item symbol limit value unit condition min typ max ?h? level input voltage vih 0.8vdd - vdd v sd, scl, csb ?l? level input voltage vil vss - 0.2vdd v sd, scl, csb hysteresis width vh - 0.2 - v scl, vdd=3.3v ta = 2 5 c ?h? level input current iih1 - - 5 ua sd,scl, csb, vi=3.6v led off leak off leak 5 0 5 ua led vi=5.5v ?h? level output voltage (*2) voh1 vlcd -0.4 - - v iload=-50ua, vlcd=5.0v seg0 to seg25 voh2 vlcd -0.4 - - v iload=-50ua, vlcd=5.0v com0 to com3 ?l? level output voltage (*2) vol1 - - 0.4 v iload= 50ua, vlcd=5.0v seg0 to seg25 vol2 - - 0.4 v iload= 50ua, vlcd=5.0v com0 to com3 vol4 - 0.11 0.5 v iload=20ma vlcd=5.0v led1 to 4 output voltage (*2) vout1 2.73 3.33 3.93 v iload=+/-50ua, vlcd=5.0v, seg0 to 25, com0 to 3 vout2 1.07 1.67 2.27 v iload=+/-50ua, vlcd=5.0v, seg0 to 25, com0 to 3 supply current (*1) istvdd - 3 10 ua input pin all ?l?, display off, oscillation off istvlcd - 0.5 5 ua input pin all ?l?, display off, oscillation off ivdd1 - 8 15 ua vdd=3.3v ta=25c 1/3bias ffr=64hz output open ivlcd1 - 10 15 ua vlcd=5.0v ta=25c 1/3bias ffr=64hz output open 1 during power save mode 1 frame inversion. 2 iload when setting the load of 1 pin only.
4/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 electrical characteristics ? continued oscillation frequency characteristics (ta=-40c to +85c vdd=1.8v to 3.6v vlcd=2.7v to 5.5v vss=0v ) item symbol limit value unit condition min typ max frame frequency 1 ffr1 76.5 85 93.5 hz vdd=3.3v ta = 2 5 c ffr=85hz setting frame frequency 2 ffr2 68 85 97.0 hz vdd=2.5v to 3.6v ffr=85hz setting frame frequency 3 ffr3 59.7 - 68 hz vdd=1.8v to 2.5v ffr=85hz setting mpu interface characteristics (ta=-40c to +85c vdd=1.8v to 3.6v vlcd=2.7v to 5.5v vss=0v ) item symbol limit value unit condition min typ max input rise time - - 50 ns input fall time f - - 50 ns scl cycle tscyc 250 - - ns ?h? scl pulse width tshw 50 - - ns ?l? scl pulse width tslw 50 - - ns sd setup time tsds 50 - - ns sd hold time tsdh 50 - - ns csb setup time tcss 50 - - ns csb hold time tcsh 50 - - ns ?h? csb pulse width tchw 50 - - ns figure 4. serial interface timing csb scl sd tcsh tscyc tsl w tshw tsds tsdh t f tr tcss tchw
5/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 i/o equivalent circuit figure 5. i/o equivalent circuit example of recommended circuit figure 6. recommended circuit example vdd vss vlcd vss vlcd seg0-25 com0-3 vss led1-4 vss vdd csb, sd, scl, clkin vss signal input from controller *about resistor value determine the optimal value based on the applied curr ent with 25ma as max per 1 port 5.0v 3.3v vlcd vdd csb sd scl vss bu979 4 1fv lcd com0 to com3 seg0 to seg25 led1 vled=5.0v led2 led3 led4
6/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 function description command ? data transfer method 3-spi 3-wire serial interface this device is controlled by 3-wire signal: csb, scl, sd. sd, scl input are enabled with csb = ?l?. also, interface count er is initialized with csb = ?h?, and the next command or data can be inputted. each command starts with command or data judgment bit (d/c) as m sb data, and continuously in order of d6 to d0 are followed after csb=?l. internal data is latched at the rising edge of scl, it will be converted to 8bits parallel data at the falling edge of 8th clk. if csb is set to ?h? when the data is less than 8bit, command and data being transferred will be cancelled. when inputting again, please set csb to ?l?. then, be sure to input command for 1byte. also, when it becomes input state of ddram data through ramwr command, command cannot be inputted. when inputting again, please start up csb. if csb is set to ?h?, the data input state is cancelled and by setting ?csb? to ?l? again, command will be received. figure 7. 3-spi data transfer format write and transfer method of display data this device has display data ram of 264 104bit. the handling of display data with write and the handlin g of ddram data and address and display are as follows: binary 8bit data is written to ddram. the address where the write begins is set with the address set command, and address is automatically incremented per 4bit data. next, by transferring data, data can be written continuously to ddram. (when continuously writing data to ddram, after writing to the final address 19h seg25 , address will return to 00h (seg0) through auto increment.) ddram address 00 01 02 03 04 05 06 07 ??? 17h 18h 19h bit 0 a e i m com0 1 b f j n com1 2 c g k o com2 3 d h l p com3 seg 0 seg 1 seg 2 seg 3 seg 4 seg 5 seg 6 seg 7 seg 23 seg 24 seg 25 d/ c d/ c d3 d6 d0 d0 d6 d6 d5 d 4 d3 d1 d 0 d/c d4 d3 d2 d1 scl csb sd d/c 3rd byte command d2 1st byte command 2nd byte command d 4 d6 d5 d1 d2 d5 10000011 1s t by te command a b c d e f g h i j k l m n o p onwards display data 00000000 a ddress set command 10100000 ram write 2n d b yte command
7/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 writing to ram is done per 4bit. when csb is set to ?h? when less than 4bit, the writing of ram is cancelled. transfer of command is done per 8bit. figure 8. display data transfer method d0 d7 d5 address 31h display data d5 d6 1st byte command / 2nd byte command d4 d3 d2 address set command d0 internal signal ram write address 00h address 01h csb address 00h d4 d4 d2 d1 d5 d3 internal signal ram write scl d7 d6 sd 1st byte command / 2nd byte command display data address 02h d6 d5 d4 d3 d7 d1 address set command scl csb sd d2 ram write command d5 d4 d3 d2 d1 d0 returns to 0 through auto increment command command ram write command d7 d6 ram write per 4bit when csb='h' is set and less than 4bit, writin g is cancelled. address 00h address 30h
8/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 lcd driver bias / duty circuit voltage is generated for lcd drive. buffer amplifier is integrated low power consumption is possible. line, frame inversion can be set via modeset command. 1/4, 1/3, static duty can be set via disctl command. for each liquid crystal drive waveform, see ?liquid crystal drive waveform?. reset initial state the reset initial state after executing software reset is as follows: ? display is turned off. ? each command register enters reset state. ? ddram address is initialized. (ddram data is not initialized. therefore, it is recommended to write initial values to all ddram before display on. command / function table function description table no command function 1 mode set (modeset) liquid crystal drive setting 2 display control (disctl) lcd setting1 3 address set (adset) lcd setting2 4 led control (ledctl) led board on/off setting 5 ram write (ramwr) ram write start setting 6 all pixel on (apon) all display on 7 all pixel off (apoff) all display off 8 all pixel on/off mode off (noron) normal display apon/apoff setting release 9 software reset (swrst) software reset
9/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 command description d/c (msb) is bit for command or data judgment. for details, see 3-wire serial interface command, data transfer method. mode set command (modeset) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 0 0 1 81h - 2nd byte command 0 0 0 0 p3 p2 p1 p0 - 00h display setting setting p3 reset state display off 0 display on 1 display off oscillation circuit operation off, liquid crystal po wer supply circuit operation off with frame cycle. display off state (output vss level) display on oscillation circuit operation on, liquid crystal power supply circuit on. read operation from ddram starts. display on state with frame cycle. led board is not affected by the on/off state of display. the output state of led port is determin ed by the setting of the ledctl command. liquid crystal drive waveform setting setting p2 reset state frame inversion 0 line inversion 1 power save mode (low current consumption mode) setting setting p1 p0 reset state power save mode1 0 0 power save mode2 0 1 normal mode 1 0 high power mode 1 1 use high power mode at vlcd 3v or higher. (reference current consumption data) setting current consumption power save mode 1 1.0 power save mode 2 1.7 normal mode 2.7 high power mode 5.0 the current consumption data above is reference data and changes according to panel load.
10/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 display control command (disctl) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 0 1 0 82h - 2nd byte command 0 0 0 0 p3 p2 p1 p0 - 02h duty setting setting p3 p2 reset state 1/4duty (1/3bias) 0 0 1/3duty (1/3bias) 0 1 static (1/1bias) 1 * (*: don?t care) when 1/3duty, the display / blin k data for com3 are invalid. (com3: same waveform with com1) when 1/1duty (static), the display / blink data for com1 to 3 are invalid. (com1 to 3: same waveform with com0) be careful in sending display data. for sample output waveform of seg/com with dut y setting, see "liquid crystal drive waveform". frame frequency setting setting (when 1/4,1/3,1/1duty) p1 p0 reset state (128hz, 130hz, 128hz) 0 0 (85hz, 86hz, 64hz) 0 1 (64hz, 65hz, 48hz) 1 0 (51hz, 52hz, 32hz) 1 1 the relationship with frame frequency (fr), internal osc frequency and dividing number is below: disctl (p1,p0) divide fr [hz] 1/4duty 1/3duty 1/1duty 1/4duty 1/3duty 1/1duty (0,0) 160 156 160 128 131.3 128 (0,1) 240 237 320 85.3 86.4 64 (1,0) 320 315 428 64 65 47.9 (1,1) 400 393 640 51.2 52.1 32 when calculating the osc frequency from the measurement value of frame frequency, us e the following equation: ? osc frequency = frame frequency (measurement value) dividing number? dividing number using the values of frame frequency setting (p1,p0) and duty setting(p3,p2), determine the values from the table above. ex) (p1,p0) = (0,1) (p3,p2) = (0,1) ? dividing number= 237 1 the value of fr in the table above is the frame fr equency calcuated as osc frequency = 20.48khz (typ).
11/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 address set command (adset) msb lsb msb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 0 1 1 83h - 2nd byte command 0 0 0 p4 p3 p2 p1 p0 - 00h sets the address that starts the wr iting to ram for normal display. address can be set from 00h to 1bh. setting is prohibited for addresses not written above. address during reset is 00h. when writing to ram, a separate ram write setting is needed. led control command (ledctl) msb lsb msb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 1 0 1 85h - 2nd byte command 0 0 0 0 p3 p2 p1 p0 - 00h sets the drive of the led port. setting during reset is 00h. the relationship between each parameter and the drive board is as follows: led1 p0 led2 p1 led3 p2 led4 p3 led on 1 1 1 1 led off 0 0 0 0 please input csb="h" after ledctl command is issued. to avoid influence of noise and reset interface. ram write command (ramwr) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 1 0 0 0 0 0 a0h - 2nd byte command display data random ???? n byte command display data random the input data after command setting is the data input for display. be sure to send this command after setting the adset command. the display data is transferred per 4bit. (for details, see ?write and transfer method of display data.?) all pixel on command (apon) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 0 1 91h - regardless of the contents of ddram, the seg output will enter all light up mode. (pin that selects seg output)
12/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 all pixel off command (apoff) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 0 0 90h - regardless of the contents of ddram, the seg output will enter all light up mode. (pin that selects seg output) all pixel on/off mode off (noron) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 1 1 93h - apon / off mode is cancelled and switches to norma l display mode. (pin that selects seg output) after reset, noron is set and becomes normal display state. software reset command (swrst) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 1 0 92h - resets software. this ic is in reset state.
13/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 liquid crystal drive waveform figure 9. lcd drive waveform during line inversion figure 10.lcd drive waveform during frame inversion 1/4duty line inversion frame inversion 1frame 1frame com0 com0 com1 com1 com2 com2 com3 com3 segn segn segn+1 segn+1 segn+2 segn+2 segn+3 segn+3 statea state a (com0-segn) (com0-segn) stateb stateb (com1-segn) (com1-segn) com1 stateb com2 com3 segn+2segn+3 com0 state a segn segn+1 segn+2segn+3 com3 state a segn segn+1 com0 com1 com2 stateb vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg
14/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 figure 11. lcd drive waveform during line inversion figure 12. lcd drive waveform during frame inversion 1/3dut y line inversion frame inversion 1frame 1frame com0 com0 com1 com1 com2 com2 com3 com3 segn segn segn+1 segn+1 segn+2 segn+2 segn+3 segn+3 state a state a (com0-segn) (com0-segn) stateb stateb (com1-segn) (com1-segn) com1 stateb com2 com3 segn+2 segn+3 com0 state a segn segn+1 segn+2 segn+3 com3 state a segn segn+1 com0 com1 com2 stateb vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg when 1/3duty com3 waveform output is same as com1 when 1/3duty com3 waveform output is same as com1 when 1/3duty com3 waveform output is same as com1
15/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 figure 13.lcd drive waveform during line inversion figure 14. lcd drive waveform during frame inversion vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg when 1/1duty (static) com1 same waveform as com0 com2 same waveform as com0 com3 same waveform as com0 when 1/1duty (static) com1 / com0 is same waveform com2 / com0 is same waveform com3 / com0 is same waveform when 1/1duty (static) com1 same waveform as com0 com2 same waveform as com0 com3 same waveform as com0 1/1duty (static) line inversion frame inversion 1frame 1frame com0 com0 com1 com1 com2 com2 com3 com3 segn segn segn+1 segn+1 segn+2 segn+2 segn+3 segn+3 state a state a stateb stateb com2 com3 stateb stateb com1 segn+2 segn+3 com0 state a segn segn+1 segn+2 segn+3 com3 state a segn segn+1 com0 com1 com2
16/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 initialization sequence execute the following sequence after power supply and start display after the ic has initialized. power supply csb ?h? ?initialize i/f csb ?l? ?start i/f data transfer execute software reset from swrst command modeset (display off) various command setting ram write modeset (display on) start display after inserting power supply, each register value, d dram address and ddram data until initialization sequence are random.
17/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 caution during power supply on/off por circuit during power supply rise, because the ic internal circuit and reset pass through an area of unstable low voltage and vdd starts up, there is a risk that the insi de of the ic is not completely reset and wr ong operation might occur. in order to prevent this, p.o.r circuit and so ftware reset functions are incorporated. in or der to ensure that oper ation, do as follows during power supply rise: 1. set power up conditions to meet the recommended tr, tof f and vbot specs below in order to ensure por operation. por circuit uses vdet type ( the voltage detection of por differs dep ending on the used environment etc. in order to make por operate for sure, it reco mmended to make it vbot = 0.5v or lower.) figure 15. rise waveform 2. when the conditions are not met, do the foll owing countermeasures after power supply on: (1) set csb to ?h?. (2) turn on the csb and execute swrst command. in order for the swrst command to take effect for sure, it is recommended to start up csb after 1ms after the vdd level has reached 90%. since the state is irregular until swrst command input af ter power supply on, countermeasure through software reset is not the perfect substitute for p.o.r f unction so it is important to be careful. figure 16. swrst command sequence vdd csb min 1ms min 50ns swrst command recommended conditions of tr, toff, vbot tr toff vbot vdet 10ms or lower 1ms or higher 0.5v or lower typ 1.2 v vdd tr toff vbot * vdet is integrated por detection level vdet
18/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 attention about using ledctl(85h) command please input csb="h" after ledctl command is issued. to avoid influence of noise and reset interface. figure 17. recommended sequence when using ledctl (85h) command attention about input port pull down satisfy the following sequence if input terminals are pu lled down by external resisters (in case mpu output hi-z). figure 18. recommended sequence when input ports are pulled down BU97941FV adopts a 5v tolerant i/o for the digital input. this circuit includes a bus-hold function to k eep the level of high. a pull down resistor of below 10k ? shall be connected to the input terminals to transit from high to low because the bus-hold transistor turns on during t he input?s high level. (refer to t he figure 5. i/o equivalent circuit) a higher resistor than approximate 10k ? causes input terminals being steady by intermediate potential between high and low level so unexpected current is consumed by the system. the potential depends on the pull down resi stance and bus-hold transistor?s resistance. as the bus-hold transistor turns off upon the input level cleared to low a higher resistor can be used as a pull down resistor if a mpu set sd and scl lines to low before it releases the lines. the low period preceding mpu?s bus release shall be at l east 50ns as same as a minimum clk width ( tslw ). 0 d/c 0 0 1p0 d6 d6 d5 d4 d3 d1 d0 d/c 0 p3 p2 p1 scl csb sd 1 2nd command 1 ledctl (85h) 0 0 0 0 d2 0 parameter scl sd csb date transaction period with mpu input "l" period input"hi-z" period
19/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes (1) absolute ma ximum ratings an excess in the absolute maximum ratings , such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is a ssumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteristi cs can be provided approximately as expected. the electrical characteristics are guarante ed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can break do wn ics. take protective m easures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and t he gnd lines. in this regard, or the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digita l block from that for the anal og block, thus suppressing the diffraction of digital noises to the analog block power supp ly resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capa city dropout at a low temper ature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient. (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of t he ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or t he gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connec ted to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to tu rn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be su re to turn off the power supply and then dismount it from the jig. in addition, for protection against static elec tricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are inev itably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdown of the input terminal. therefore, pay thorough attention not to handle t he input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluc tuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well.
20/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes - continued (11) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. (12) no connecting input terminals in terms of extremely high impedance of cmos gate, to ope n the input terminals causes unstable state. and unstable state brings the inside gate voltage of p-channel or n-chann el transistor into active. as a result, battery current may increase. and unstable state can also causes unexpected operat ion of ic. so unless otherwise specified, input terminals not being used should be connected to the power supply or gnd line. (13) rush current when power is first supplied to the cmos ic, it is possible t hat the internal logic may be unstable and rush current may flow instantaneously. therefore, give special condition to pow er coupling capacitance, power wiring, width of gnd wiring, and routing of connections. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
21/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ordering information b u 9 7 9 4 1 f v - e 2 part number package packaging and forming specification e2: embossed tape and reel ( ssop-b40 ) fv : ssop-b40 physical dimension tape and reel information marking diagram (unit : mm) ssop-b40 0.08 m 0.1 s 0.22 0.1 0.65 0.15 0.1 0.5 0.2 7.8 0.3 5.4 0.2 1.8 0.1 0.1 1 40 20 21 13.6 0.2 (max 13.95 include burr) ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin ssop-b40(top view) bu97941 part number marking lot number 1pin mark
22/22 BU97941FV max 104 segments (seg26com4) datasheet tsz02201-0a0a2d300080-1-2 1.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 revision history date revision changes 1.jun.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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